ITT Veam and Cannon to Showcase Leading Rail Interconnect Solutions at SIFER 2019 in Lille, France
A manufacturer of equipment to test chip packages required a smaller cylinder to fit into their design envelope for a new multiprobe machine.
A manufacturer of equipment to test chip packages required a smaller cylinder to fit into their design envelope for a new multiprobe machine. Initially using a competitor's 40mm x 25mm product, they realized they did not have enough room. ITT asked to supply a cylinder with same bore and stroke but shave valuable millimeters off installation space.
The machine featured 4 test regions with each region consisting of 16 cylinders working in pairs to press and secure each board into a test socket.
The customer is extremely happy and sells 50-75 units per year with each machine consisting of eight of these manifolds and 64 switches.
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